| 摘要 |
PURPOSE:To enable to examine the existence of defects at substances to be formed by scribing, and to enable to examine immediately qualities and the rejection rates of the respective substances according thereto by a method whereto by a method wherein an examining device is so constructed as to enable to use together defect positional information on the surfaces to be examined, and scribing information of the substances to be formed by scribing the surface to be examined thereof. CONSTITUTION:A wafer 11 transferred to a test part 15 from a conveyance outward path 17 is wholly scanned at the test part 15, and existing defect information is outputted from a defect judging circuit 30, and moreover coordinate information at this time is outputted from a coordinate index circuit 31 to a signal synthesizing circuit 32 respectively. While at the same time therewith, information of wafer size and chip size, etc. of the wafer 11 to be examined is inputted to the signal synthesizing circuit 32 from an input part 35 and a chip arrangement circuit 36. Accordingly, scribing into chips of the wafer 11, distribution of defects, etc. are drawn at a drawing instrument 33 conforming to the whole information thereof at the signal synthesizing circuit 32. As a result, scribing of the chip 11a and the defects (x) distribution thereon are expressed as shown in the figure, and accordingly, qualities of the respective chips and the number of the inferior chips can be examined immediately. |
