| 摘要 |
PURPOSE:To improve an adhesion between a conductor layer for electric supply and an antioxidation layer and at the same time, prevent a loss of solder caused when these layers are soldered to an external circuit by making the conductor layer for electric supply provided on a heat generating resistor layer to be of a special three-tier structure. CONSTITUTION:In a thermal head consisting of a heat generating resistor layer 3, a conductor layer for electric supply 9, an antioxidation layer 5 and a protective layer for wear resistance 6 formed in that sequential order on a glazed layer 1 of an insulative substrate 2, the conductor layer for electric supply 9 is constituted in three-tier form with a main conductor layer 92 consisting of a good conductor metal film (of selected Al or Cu) adjoining the heat generating resistor layer 3, an upper conductive layer 93 of solderable metal film (of selected Ni, Cu, Sn, Pb, Fe, Cd, Zn, Cu-Zn alloy, Cu-Sn alloy or Cu-Ni alloy) and a surfacial oxidized layer of said upper conductor layer 93. |
