| 摘要 |
The invention relates to an arrangement for making contact with contact elements on thick-film circuits, and is used in microelectronics for hybrid circuits, pin-grid housings, multi-chip ceramic modules etc. The aim is to achieve high packing density with low material and manufacturing costs, it being intended to create an adhesion resistance layer system, particularly after alternating temperature stress, and multi-level construction. This is achieved using a reduction-stable, thick-film compatible ceramic and by the ceramic being printed with a thick-film conductive paste overlapping the connecting base and the layer which can be soldered. <IMAGE> |
