Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same.

摘要

A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 mu m comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AlN) substrate and a copper member; and joining said aluminium nitride (AlN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.