| 摘要 |
PURPOSE:To reduce manufacturing cost by feeding a monomer and an electrically conductive filler into a mold, polymerizing it, molding a cylindrical conductive plastic substrate on the inner circumference of the mold, and imparting conductivity without surface treatment. CONSTITUTION:A mixture of a monomer and a conductive filler is spread on the inside circumference of a mold in a uniform thickness by a centrifugal force caused by rotation, and it is polymerized in this state to form a cylindrical conductive substrate 1 uniform in thickness. The outer surface of this cylindrical conductive substrate 1 is coated with a coating fluid obtained by dispersing a photoconductor powder into a binder resin, and dried to form a photosensitive layer, and an electrophotographic sensitive body. The obtained conductive substrate is made of plastics, and conductivity is imparted without metal plating, the outer surface can be smoothed easily with the mold and securely with the mold, inexpensive conductive substrate can be obtained, and manufacturing cost can be lowered. |
