| 摘要 |
A semiconductor device forming a hermetically sealed housing for a semiconductor element, comprising a base member, a wall member surrounding the semiconductor element, and a cover hermetically sealed to the wall member. According to the invention, an intermediate annular member (17) is interposed between the cover (11) and wall member (12 min ), the intermediate member being attached to the cover by a solder glass (16) and exhibiting a metal surface facing the wall member for being attached to the wall member by metallic solder. A protrusion (15) of the wall member (12 min ) fully or partly surrounds the intermediate member (17) and is also attached thereto by metallic solder. This structure enables the manufacture of a perfectly sealed housing without applying excessive heat to the assembled device which may damage the semiconductor element. |
