发明名称 Forming platinum contacts to in-based group III-V compound devices
摘要 Electrical contacts with low specific-contact resistance to In-based Group III-V compound semiconductors (e.g., p-InGaAsP) are formed by electron beam depositing a thin Pt layer directly on the semiconductor and sintering at about 450 DEG -525 DEG C. for about 5-30 minutes. Light emitting diodes without dark spot defects can be fabricated using this technique.
申请公布号 US4538342(A) 申请公布日期 1985.09.03
申请号 US19840621082 申请日期 1984.06.15
申请人 AT&T BELL LABORATORIES 发明人 CAMLIBEL, IRFAN;CHIN, ALAND K.;CHIN, BRYMER H.;ZIPFEL, CHRISTIE L.
分类号 H01L21/28;H01L21/285;H01L29/43;H01L31/0224;H01L33/14;H01L33/30;H01L33/40;(IPC1-7):H01L21/285 主分类号 H01L21/28
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