| 摘要 |
PURPOSE:To simultaneously manufacture numerous piezoelectric oscillating pieces, by performing the etching of one wafer by using a mask made of a same material as the wafer being etched and having different thickness. CONSTITUTION:A mask 4 is formed on a piezoelectric thin film of crystal, etc. The thickness of the mask 4 is varied in accordance with the shape to be formed and a material which is etched at the time of etching of the piezoelectric thin film is selected for the mask 4. When the etching of the thin film is performed by chemical etching of hydrofluoric acid, etc., the mask 4 gradually melts and an oscillating piece 5 whose shape in the direction of thickness resembles the shape of the mask 4 is formed. Therefore, numerous oscillating pieces 5 can be formed at once because their outer shape can be formed at the time of etching as described above. |
