Retention and cooling of plug-in electronic modules in a high shock and vibration environment

摘要

Method and apparatus are disclosed for selectively clamping the edges of electronic modules into mechanical and thermal contact with a fluid coolant circuit. A stack of plural substantially parallel and generally planar fluid conduit-containing structures having spaced apart parallel legs jointly receive a stack of plural generally planar electronic modules disposed transversely therewithin. Each of the fluid conduit-containing structures includes mechanical/thermal contact pads disposed approximately perpendicular to its general plane on the inside edges of the parallel legs with the pads on some of the structures being directed one way and those on others of the structures being directed in an opposite way. At least one such set of structures is then collectively moved so as to selectively clamp the edges of the stack of electronic modules between opposingly directed contact pads. A special type of fluid conduit-containing structure formed by bonding two or more elongated sheets of spring metal along the boundaries of mating indentations is preferably employed with at least portions along one edge of the bonded sheets comprising the structure being oppositely bent up into individual and/or into pairs of spring pads to realize the contact pads just discussed.