| 摘要 |
An integrated circuit (IC) assembly 10 using an IC carrier is disclosed. An IC 15 and IC carrier together form a carrier subassembly 11 in which two parallel rows of IC leads 20 and 21 are received by carrier contacts 28 mounted in openings 27 in a horizontal portion 14 of a main carrier member 13. Extending pin portions 30 of the carrier contacts vertically extend from the horizontal portion openings into two carrier channels 31 and 32 wherein the extending pin portions and carrier channels are dimensioned so as to recess the pin portions and prevent finger access thereto. A socket subassembly 12 is provided comprising a main socket member 40 having two raised islands 44 and 45 each with a row of socket contacts 41 fixed therein. Each socket island is dimensioned for removably fitting within one of the carrier channels with the carrier pin portions mating with the socket contacts. The main carrier member is provided with a heat sink 25 on which the IC is mounted, and the horizontal portion 14, main carrier sidewalls 17 and a cover 16 form a main carrier cavity 18 in which the IC is mounted. The socket subassembly is mounted to a printed circuit board 49. The recessing of carrier pin portions in the carrier channels permits manually handling the carrier subassembly 11 without risking static electricity discharge damage to the IC or mechanical lead damage.
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