发明名称 GLASS SEALED ELECTRONIC PARTS
摘要 PURPOSE:To improve sealing characteristics, by using a glass, whose pour point is 700-800 deg.C and thermal expansion coefficient is 35X10-7-50X10-7 [1/ deg.C], as a glass for bonding and sealing a silicon disc and a metal shell. CONSTITUTION:A silicon disc 3 is fixed on a shell 1 made of Cobal through a glass 2. The shell 1 and the disc 3 are bonded and sealed by the flow of the glass 2. A glass, which has a composition of 54wt% ZnO, 1wt% ZnF2, 31wt% B2O3, 4wt% SiO2, 5wt% Al2O3 and 5wt% P2O5, is melted at 1,200 deg.C as the glass 2. Then a thermal expansion coefficient alpha=45X10<-7> [1/ deg.C] and pour point Tf=750 deg.C are obtained. The thermal expansion coefficient is approximate to that of Cobal, and cracks are not yielded in the glass.
申请公布号 JPS60169155(A) 申请公布日期 1985.09.02
申请号 JP19840022770 申请日期 1984.02.13
申请人 TOSHIBA KK 发明人 KOBAYASHI KEIJI
分类号 C03C8/24;C03C12/00;C03C29/00;H01L21/58;H01L23/10 主分类号 C03C8/24
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