| 摘要 |
PURPOSE:To obtain the titled electrode strong in adhesion with a carrier tape by a method wherein the center of the region of forming said electrode is kept projected with a metallic wiring. CONSTITUTION:A semiconductor substrate 1 finished in element formation is provided with Pt wiring patterns 2. A photo resist pattern 3 is formed on this substrate. This substrate is dipped in an Au plating solution, and an Au wiring 4 is formed by plating. Next, the resist pattern 3 is removed, and a photo resist pattern 5 is formed. This substrate is dipped in the Au plating solution, and an Au projection electrode 6 is formed by plating. At this time, the presence of the Au wiring 4 previously formed at the center of the region of forming said electrode avoids the generation of a recess step in said electrode. Thereafter, said electrode 6 of desired shape is obtained by wholly removing the photo resist 5. |
