| 摘要 |
PURPOSE:To manufacture a printed coil having a high space factor with favorable yield, easily and at low cost by a method wherein conductive metal layers are formed according to electroplating. CONSTITUTION:A thin film conductor layer 5 is formed on one side of a flexible insulating sheet 4, and a resist layer 6 having resistance against plating is formed thereon in a reverse wiring figure type to the desired coil pattern. Then electroplating is performed on the exposed thin film conductor layer 5 to form a conductive metal layer 7 in the desired coil pattern type. An insulating adhesive 9 is applied on the whole surface of the metal layer 7, in a gap between the metal layer thereof and on the exposing resist layer 6, and moveover an insulating substrate 10 is adhered thereon. Then the flexible insulating sheet 4 is exfoliated, and the exposed thin film conductor layer 5 is dissolved to be removed according to an etching liquid. Then by performing electroplating again to deposite a second conductive metal layer 7' on the exposed coil pattern type conductive metal layer 7, the symmetrically conductive metal layers 7, 7' are formed at the upper part and the lower part of the resist layers 6. |
