| 摘要 |
PURPOSE:To contrive the miniaturization in outer dimension of packages and the facilitation in mounting work by a method wherein outer lead pins are sealed with resin so as to project out of the bottom of a package opposed to a mounting substrate. CONSTITUTION:Normal dice bonding and wire bonding are carried out by mounting a semiconductor chip 2 on a lead frame 1, connecting it with metallic fine wires 3, and further bending lead pins in the state of a chain of the lead frames 1. In this state, sealing is performed with a collective sealing resin 4 such as transfer mold by means of a metal mold. Then, a completed product as shown in the figure is obtained by splitting individually from the lead frame 1. Since the lead pins 5 are bent in the resin and project out of the bottom of the sealing resin 4, this semiconductor device is capable of plug-in system mounting as a DIL package; therefore, automation is promoted. |
