| 摘要 |
PURPOSE:To mass-product the titled device having a mass of bonding with good yield by reducing the frequency of contact of wires with each other by a method wherein bonding adjacent bonding wires are positioned at a relative distance in a spatial manner from each other in electrical connection between a photosensor array and a drive circuit. CONSTITUTION:One end of a bonding wire is connected at a position of 1mm. distant from the end surface of the first discrete electrode 25-1 of the photosensor array, and next a bonder tool 40 is moved toward the first opposite electrode 32-1; then, similarly the other end of the first bonding wire 35-1 is connected at a position of 1mm. distant from the substrate end surface. Likewise, the second bonding wire is connected now at a position of 1.5mm. distant from the end surface. Thereafter, the positions of connection of bonding wires are likewise alternately arranged in order in staggered form on respective substrates. |
