| 摘要 |
PURPOSE:To enable to non-destructively inspect the junction condition of the stitch bonding part of a copper wire to a lead terminal by a method wherein the tip of a capillary chip is pressingly welded on the lead terminal and the size of an indentation, which is formed on the lead terminal by the pressure-welding, is inspected. CONSTITUTION:In case that a 25-mum diameter copper wire 6 is performed a stitch bonding on a silver plated lead terminal 4 by a thermocompression bonding method combined with an ultrasonic bonding using a capillary chip 5, the feed ultrasonic energy to the capillary chip 5 exceeds a specific value at a point. At that time, the tip of the capillary chip 5 is pressingly welded on the silver plated lead terminal 4, an indentation is formed and the configuration of this indentation becomes larger corresponding to an augmentation of the feed ultrasonic energy. Accordingly, after the stitch bonding was performed, whether there is any indentation due to the capillary chip 5 on the silver plated lead terminal 4 is inspected using a TV camera and so forth, and the size of the indentation can be measured. As a result, the junction condition of the stitch bonding part can be non-destructively inspected. |
