| 摘要 |
PURPOSE:To bond an outer lead with high precision by detecting positional displacement by each camera for a lead frame and a semiconductor device before the lead frame and the semiconductor device are superposed, compensating these positions and superposing the semiconductor device to the lead frame. CONSTITUTION:When a semiconductor device 3a is forwarded to a die hole 2a and a tape 3 is positioned, a clamper 4 is clamped. A punch 6 is lifted, the device 3a is punched, and the device 3a is sucked by a punch hole 6a. A table 7 is moved and compensated so that the end section of a lead is conformed to a reticle for a detecting camera 8 under the state, and the quantity of compensation is memorized to a computer. When the lead section in a lead frame 15 is positioned, the quantity of displacement is detected by a camera 19, and memorized to the computer. Consequently, the table 7 is driven by the quantity of displacement between the device 3a and the lead section, and the punch 6 is moved to the lower section of the lead section. The punch 6 is elevated, the device 3a is pushed against the frame 15, and the device 3a is bonded with the frame 15 by a tool 18. |
