| 摘要 |
PURPOSE:To manufacture a printed coil having a high space factor with favorable yield, easily and moreover at low cost by a method wherein conductive metal layers are formed according to electroplating. CONSTITUTION:A resist layer 5 having resistance against plating is formed in a reverse wiring figure type to the desired coil pattern on one side of a metal substrate 4. A conductive metal layer 6 is adhered according to electroplating to the surface of the exposed metal substrate 4 to form the desired coil pattern. Insulating resin 7 is applied on the whole surface of the conductive metal layer 6, in a gap between the layer thereof and on the exposing resist layer 5, an insulating sheet 8 is adhered on the surface thereof moreover, and the insulating resin 7 is heated to be hardened. The metal substrate 4 is exfoliated, and the resist layer 5 and the first conductive metal layer 6 between the resist layer thereof is exposed. Then a second conductive metal layer 6', a copper layer for example, is adhered according to electroplating on the exposed conductive metal layer 8 similarly thereto. |
