PHOTOELECTRIC CONVERSION DEVICE

摘要

PURPOSE:To ensure electrical connection between a photosensor array and its drive circuit by a method wherein the part of electrical connection between the drive circuit for the electrode of the photosensor array is formed on a substrate without interposing a photoconductive layer. CONSTITUTION:The photosensor array is connected to the connection electrode 9 on a drive circuit substrate 8 by Al supersonic wire bonding with a bonding wire 10. This manner can improve the yield at the time of mass production by electrical connection between the photosensor array of the titled device and its drive circuit with a sufficient strength. Besides, a photoconductive layer is not present under the position of bonding wire connection of the electrode of the photosensor array, the insulation of electrodes improves and micro currents can be detected at high S/N ratios.