| 摘要 |
PURPOSE:To facilitate pattern plating by unnecessitating the removal of a conductive film unnecessitated after plating by a method wherein the lift-off method is adopted for the pattern plating. CONSTITUTION:The base conductive film 8 is deposited by the vapor deposition method after formation of a photo resist pattern 6 on a substrate 1. The material of the conductive film 8 is different with the materials of the substrate and the plating film and the like: e.g. aluminum, chromium, titanium, chromium-copper double-layer film, or titanium-copper double-layer film is used. At this time, the conductive film 8 generates step cuts at ends of the photo resist pattern 6; accordingly, the film 8 on the pattern 6 comes into an electrical floatation. Next, the plating film 7 is formed on the conductive film 8 on the substrate 1 by plating with the film 8 on the substrate 1 as the cathode; however, the plating film 7 is not formed on the film 8 on the photo resist 6 because of insulation. Finally, a desired plating film pattern is obtained by removing the photo resist 6 by flux with an organic solvent. |
