| 摘要 |
<p>PURPOSE:To allow a semiconductor rectifier element to be adapted for an automobile by composing a heat sink plate which mounts a semiconductor element of a copper clad iron, and securing the element to the copper layer of the surface layer, thereby enhancing a thermal impact resistance. CONSTITUTION:One surface of an Si chip 1 is secured with a solder layer 3a to the recess of the surface of a cup-shaped electrode plate 2 which is used also as a heat sink plate, and a lead 4 is connected through a solder layer 3b with the other surface. Silicone resin 5 is filled in an air gap on the plate 2 while projecting the upper end of the lead 4 as a semiconductor rectifier. In this structure, the plate 2 is coated with copper layers 11b on the front and back surfaces of an iron strip 11a of a core material, and the chip 1 is mounted on the layer 11b. here, the ratio of the copper to the iron of the clad material is important, and when the ratio of the iron is larger, thermal stress decreases, but the heat sink is deteriorated. On the contrary, when the ratio of the copper is larger, the properties are vice versa. However, the ratio of the iron is increased here by considering the utility of the rectifier.</p> |
