| 摘要 |
PURPOSE:To prevent the difference between an actual plating thickness and a target plating thickness from being increased even when the target plating thickness is changed, by a method wherein the cathodic efficiency itself in a real plating step can be continuously corrected, in the titled method in a continuous electroplating process. CONSTITUTION:A target plating thickness u0 and a cathodic efficiency is set, a signal of the thickness u0 is inputted into a simulating means 40 and a plating device 44, and mimic and real plating processes by the means 40 and the device 44 are made to progress concurrently. The error (e) of the plating thickness up in the real plating process from the plating thickness um in the mimic plating process is calculated by a comparing part 45, and a calculating means 49 calculates a correction quantity Kc for the cathodic efficiency in the real plating process on the basis of the error (e). Based on this, the cathodic efficiency in the real plating process is corrected by a correcting part 41 so as to become equal to a set point of the efficiency on the side of the means 40. Simultaneously, these operations are continuously repeated, whereby the thickness up of a plated film on a work in the real plating process is controlled so as to accord to the thickness um, namely, the thickness u0.
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