发明名称 PLATING TREATMENT OF METALLIC WIRE
摘要 PURPOSE:To enable a favorable plating treatment even with a high current density and avoid troubles of mist or piping, by vibrating a metallic wire immersed in a plating liquid when electroplating the wire. CONSTITUTION:A metallic plate 13 as an anode and the metallic wire 14 as a cathode are immersed in the plating liquid 12 contained in a plating tank 11. The wire 14 is supported by electrode rolls 16 functioning as a support in the exterior of and on both sides of the tank 11. Vibrating rods 18 having a small hole 17 permitting the wire 14 to pass therethrough between the tank 11 and the rolls 16 are provided on both sides of the tank 11, and are vertically vibrated through clamps 20 by driving a motor 19, thereby vibrating the wire 14. Accordingly, since the relative movement of the wire 14 and the liquid 12 is increased, a diffusion layer of ions of a metal such as Cu, Zn, Ni and Cr can be reduced, and a favorable plating treatment can be conducted even with a high current density. The wire may be vibrated in the horizontal direction or the circumferential direction thereof.
申请公布号 JPS60165390(A) 申请公布日期 1985.08.28
申请号 JP19840022591 申请日期 1984.02.08
申请人 SUMITOMO DENKI KOGYO KK 发明人 MATSUSHIMA NORIHISA;YOSHIMURA YOSHIO;NISHIMURA YOSHIFUMI
分类号 C25D7/06 主分类号 C25D7/06
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