| 摘要 |
PURPOSE:To obtain a noise-free, highly reliable, highly integrated hybrid integrated circuit by packaging components on both faces of a hybrid integrated circuit substrate, and by constituting not to package other circuit components on a reverse surface of a minute signal circuit part. CONSTITUTION:Since a semiconductor integrated circuit IC1 contains an initial part of an amplifier circuit 3 (or B), and differentiation circuit 5, comparator 6, and timed mainfilter 7, a drive device is arranged almost on the center of a substrate 9. Since micro input signal is pins Nos. 1 and 2 of the circuit IC1, a parts of a micro signal circuit A alone is arranged in an area E on this side. Further, the area E' of the reverse opposite to the area E is also packaged with only the components of the circuit A and a free space is made as an overall earth pattern. A digital output part D is arranged in an area at the opposite side to the area E with respect to the circuit IC1 and at the same time components of a rear step amplifier B and a filter circuit C are packaged at locations except the micro signal area E' with respective to the integrated circuit IC1.
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