| 摘要 |
PURPOSE:To automate fixing and to automate wiring of thin metal wire, by fixing a cap frame, to which glass is attached, outer leads and a semiconductor element, combining them with an element substrate, to which the metal thin wire is connected, and performing sealing. CONSTITUTION:A light transmitting cap 1 and a ceramic frame 3 are fixed by a first glass 2. Then, a second glass 4, which is to become a sealing material, is formed. The second glass 4, which is to become the sealing material, is formed at a part other than a slender cavity at the approximately central part of a ceramic substrate 5. Thereafter, outer leads 8 are attached. A semiconductor element 7 is fixed and wiring of a thin metal wire 6 is completed. Thus an element substrate is obtained. A cap frame, in which the cap 1 and the frame 3 are fixed, and the element substrate are sealed by the glass 4. Thus, the fixing is automated, and the wiring of the thin metal wire is automated. |
