发明名称 COMPOSITE LEAD PIN
摘要 PURPOSE:To stabilize the connecting strength of a ceramic substrate and a pin by using a composite pin connected concentrically with a brazing material as a lead pin when opening the lead pin inserting hole at the substrate having a Cu- metallized layer on the surface and inserting the pin into the hole, thereby utilizing the brazing material for brazing with the metallized layer. CONSTITUTION:When a lead pin 4' is inserted and secured to a ceramic substrate 3 formed with a Cu-metallized layer 2 on the surface and a lead pin inserting hole 1, the pin 4' is not formed as a continuous pin, but formed as a composite pin made of Kovar, or Fe-Ni alloy. In other words, pins 4a, 4b are contacted concentrically, bonded with a brazing material 5' of Au or Ag, and the material 5' is swelled at the bonding end with the pins 4a, 4b. After thus constructed and the pin 4' is inserted into the hole 1, they are filled in a furnace, heated, the material 5' is melted, and bonded to the layer 2. Thus, even if the amount of the material 5' is excess or insufficient, it automatically becomes in a meniscus shape, and the pin 4' and the substrate 3 are rigidly coupled.
申请公布号 JPS60165746(A) 申请公布日期 1985.08.28
申请号 JP19840020641 申请日期 1984.02.07
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 TAKARASAWA KATSUYUKI
分类号 H01L23/50;H01L23/498;H01R4/02;H01R9/16 主分类号 H01L23/50
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