| 摘要 |
Gold films (18) of essentially uniform thickness are plated onto respective previously formed palladium films (16) on substrates (10) by loading the substrates into a box plater (20) in opposed relationship to respective anode plates (22). In a plating operation, a plating potential initially is applied across upper end portions of the palladium films (16) and the anode plates (22). The loaded box plater (20) then is lowered into a gold plating bath (28) at a preselected rate to progressively immerse the substrates (10) and the anode plates (22) into the plating bath, such that gold plates onto each palladium film (16) to an essentially uniform thickness. The substrates (10) and anode plates (22) then are left immersed in the plating bath (28) for a total time period dependent upon the desired final thickness of the gold films (18).
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