| 摘要 |
PURPOSE:To enable to continuously supply pellets in an efficient manner by a method wherein a wafer ring, having wafers which are brought into the state wherein they are diced on the diode pellet on an adhesive tape, is fixed facing downward and it is supplied into a sealing jig by pushing out the pellet from the back side of the adhesive tape using a pin. CONSTITUTION:A pellet guide jig 12 is superposed on a pellet sealing jig 11, and a wafer ring is fixed facing downward to the upper part of the guide jig 12 by a wafer ring mounting member 5. Besides, a push-out pin 4 which performs a vertical movement is provided on the back side of a tape located on the wafer ring. The push-out pin 4 and the wafer ring mounting member 5 are formed in one body and perform a parallel movement on the surface of the guide jig 12 along pellet supply holes H1, H2,.... Then, an arbitrary pellet P1 located on the adhesive tape and the push-out pin 4 are set in such a manner that the position of the arbitrary pellet supply hole H1 of the guide jig 12 will be facing just above. Subsequently, the push-out pin 4 is lowered, and when the pellet P1 is pushed out from the back side of the adhesive tape, the pellet is supplied to the prescribed position of the sealing jig 11. |
