发明名称 |
High power semiconductor heat sink assembly |
摘要 |
A high power semiconductor heat sink assembly comprising a semiconductor slice or chip and a heat sink structure. The heat sink structure comprises two spaced apart thermally and electrically conductive plates of for example aluminum between which the slice or chip is clamped. A device such as an O-ring is sandwiched between the plates so as to extend around the slice or chip and define a sealed compartment within which the slice or chip is located. An electrically non-conductive thermally conductive material such as a resin comprising alumina fills the space between the plates outside the compartment.
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申请公布号 |
US4538171(A) |
申请公布日期 |
1985.08.27 |
申请号 |
US19810310255 |
申请日期 |
1981.10.09 |
申请人 |
CABLEFORM LIMITED |
发明人 |
STEVENS, KEITH D.;HARRISON, JOHN;KAYE, STANLEY B. |
分类号 |
H01L23/373;H01L23/40;H01L23/42;(IPC1-7):H01L23/02;H01L23/32 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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