Low temperature sealing composition

摘要

A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450 DEG C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt. % vitreous solder glass powder of PbO-B2O3 system having a deformation point of 350 DEG C. or less, 1-35 wt. % first ceramic powder and 1-45 wt. % second ceramic powder. The total amount of the first and second ceramic powders is 20-50 wt. %. The first ceramic comprises 68-75 wt. % ZnO, 23-28 wt. % SiO2 and 0-8 wt. % Al2O3, and the second ceramic comprises 98-99.9 wt. % SnO2 and 0.1-2 wt. % ZnO.