| 摘要 |
PURPOSE:To prevent breakage of a liquid crystal device owing to thermal stress of electrodes, peeling from a support, etc. by disposing a material having the coefft. of thermal expansion between the coefft. of thermal expansion of the electrodes and the coefft. of thermal expansion of the support as a thermal stress relieving layer between said electrodes and the support. CONSTITUTION:A material having the coefft. of thermal expansion between the coefft. of thermal expansion of electrodes 24 and the coefft. of thermal expansion of a support 22 is disposed as a thermal stress relieving layer 25 between the electrodes 24 and the base 22. The polyimide contg. the monomer expressed by the formula I or the polyimide contg. the monomer expressed by the formula II or the polyimide contg. the monomer expressed by the formula III (Ar2 is a dehydric aromatic group and Ar3 is a tetrahydric arom. group) is used as such material. These polyimides have about 10X10<-6>/ deg. coefft. of thermal expansion. On the other hand, the support 22 consisting of glass has about 3.25X10<-6>/ deg. coefft. of thermal expansion and the electrodes 24 have about 23X10<-6>/ deg.. The thermal stress generated owing to a difference in the coefft. of thermal expansion between the electrodes 24 and the base 22 as a result of generation of heat in the electrodes 24 is thus relieved and the breakdown and peeling of the electrodes 24 are prevented.
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