| 摘要 |
PURPOSE:To contrive to reduce inferior products, and to reduce the manhour of a visual inspection at manufacture of a semiconductor device by a method wherein the separating part of a tab hanging lead is provided a little inner side than the side wall of a resin sealed part, and the breaking area of the separating part thereof is made smaller than the sectional area of the tab hanging lead. CONSTITUTION:The separating part 2 of a tab hanging head 1 is provided a little inner side than the side wall of a molded part 4. Moreover, the separating part 2 provided to a lead frame 7 is formed in a shape opened with a quadrilateral hole 1C as to form fine frames 1A, 1B of two pieces of width narrower than width of the tab hanging lead 1 as not to apply damage as much as possible to the molded part 4 when the tab hanging lead 1 mentioned above and the lead frame 7 are to be separated. By forming the lead in the shape providing with V-shaped notches at the prescribed positions of the fine frames 1A, 1B of two pieces thereof, breaking force is made small, and moreover, the breaking area of the exposed part is also made small. Moreover, by opening a triangular hole 1D as to make the corners thereof to come to both the edges of the tab hanging lead 1, or by making the tab hanging lead 1 in a half cut condition provided with a step difference, the effect the same with as said above can be obtained. |
