| 摘要 |
PURPOSE:To realize high density mounting of a semiconductor device insuring high productivity by a method wherein the leads of a lead frame are bent, and the device is so constructed as to make the surfaces of a part of the leads thereof to be exposed in the condition nearly coinciding with the surface of a resin molded package. CONSTITUTION:Leads 4 are bent at nearly right angles in the neighborhood of a tab 6, and bent toward the outside at nearly right angles again as to be made in nearly parallel with the tab 6 in the neighborhood of dums 7, the parallel parts of the leads in the neighborhood of the tab 6 are made as to construct the inner parts 4a, the parallel parts in the neighborhood of the dums 7 are made as to construct the outer parts 4b, and the standing up parts of the middle thereof are made as to construct the rigid parts 4c respectively. A pellet 8 is bonded to the tab 6 on the surface on the opposite side from the bent direction of the leads 4, and the pellet 8 is connected electrically through bonding wires 9 to the inner parts 4a at the respective leads 4. A lead frame 2 having the construction mentioned above is unhermetically sealed according to a package 10 formed by resin molding. |
