| 摘要 |
PURPOSE:The titled composition useful for sealing semiconductor elements of LSI or VLSI, having extremely small internal stress during curing, high glass transition temperature and improved humidity resistance, obtained by blending a polyfunctional novolak epoxy resin with a specific curing agnet of novolak resin. CONSTITUTION:(A) A polyfunctional novolak epoxy resin having >=60 deg.C curing point is blended with (B) a curing agnet of novolak 2,2-bis(4,4'-hydroxyphenyl) propane/phenol/formaldehyde resin (molar ratio of propane: phenol=50:50-100:0, and equivalent ratio phenolic hydroxyl group to 1 equivalent epoxy group in the component A of 0.7-1.3), or a curing agent of 2,2-bis(4'-hydroxyphenyl)propane/ formaldehyde resin, (C) a curing promotor, and (D) an inorganic filler.
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