| 摘要 |
PURPOSE:To reduce any cutoff residue and needless resin by a method wherein, in a dam resin part of a package for semiconductor device, a hole is opened at the edge of a punch for removing the dam resin to make any gas or liquid jet therefrom. CONSTITUTION:A semiconductor device 2 is installed in a cavity inside a metallic die 1 comprising a top force and a bottom force to fill the cavity at one end of the device 2 with a dam resin 4. Next a dam resin punch 3 is inserted into a hole communicated with the metallic die 1 to cut off and drop any needless part of the resin 4 however the cut off resin 4 is held inside the metallic die due to the space vacuumized between the punch 3 and the resin 4. Therefore another hole 3 is opened pircing the punch 3 to jet any gas or liquid forcibly dropping the resin 4. |
