| 摘要 |
PURPOSE:To obtain a high resolution picture with improved horizontal resolution and decreased moire by giving vibration having two kinds of frequency components to a solid-state image pickup element chip substrate oprated while taking two fields as one frame period. CONSTITUTION:The inter-line transfer type CCD image pickup element chip substrate 1 is vibrated relatively to an incident optical image in the direction (X direction) of horizontal picture element arrangement. The 1st vibration is the vibration where X3 is the center of vibration, X2, X4 is the amplitude and one frame is taken as one period, and the 2nd vibration where the center of photosensitive part is changed in high speed is superimposed on the 1st vibration between X1 and X3 for the field A and between X3 and X5 for the field B respectively. Then a field shift pulse is generated at field switching points of time t1, t3 so as to read the signal charge stored between the period t2 and t4. As a result, the opening 2 of the picture element is expanded and the horizontal resolution is improved. Moreover, the opening is expanded into the opening shown in 2A, 2B simulatingly by vibrating it at the 1st vibrating period and periods 31, 32 where the openings are overlapped at the fields A, B are formed. As a result, the flicker due to moire is improved.
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