| 摘要 |
PURPOSE:To obtain the electrode structure of strong adhesive strength and low contact resistance by using two-layer film composed of Ti as the bottom layer and a metallic film of one of Au, Ag and Cu as the upper layer for a base metallic film of a projecting electrode. CONSTITUTION:A Ti film 10 is vapor-deposited on a surface of a terminal electrode 4 for a projecting electrode and subsequently an Au film 11 is vapor-deposited. After that, liftoff is performed to form the desired pattern shape. Next, by using a metal mask prepared previously, positions of the electrode 4 and an aperture part of the mask are adjusted and then In, Sn and Bi are vapor deposited. After removing the metallic mask, a substrate 1 is heated under the predetermined conditions and In, Sn and Bi are reflown to form a hemispherical projection electrode 12. The projecting electrode base metallic film thus fabricated has the low contact resistance and the adhesive property which is enough mechanically. |
