| 摘要 |
PURPOSE:To remove thin resin flashes being coated on the surfaces of the lead frames of a resin-molded semiconductor device without damaging the resin molded part of the device by a method wherein the main part of the device including the semiconductor pellet is coated by molding with a resin material and water is sprayed on the lead frame parts exposing from the resin material. CONSTITUTION:Thin resin flashes 12 are being coated on the leadout parts 2a of the leads of a resin-molded semiconductor device 10 and are remaining intact without peeling off from the lead-out parts 2a. After a resin molding was performed on the semiconductor device 10, water 21 is made to jet on the lead frame parts by numerous nozzles 20 from upward and downward while the lead frames are being fed. The resin flashes 12 are simply being coated on the surfaces of the lead frames 4 and are under a condition that the resin flashes 12 are easy to peel off from the surfaces, in contrast to a resin molded part 17 where has been thickly surrounded its heat radiating part with a resin material from the surroundings, has been integrally formed in one body with the resin material and has a considerable large strength against stripping. As a result, the resin flashes being coated on the surfaces of the lead frames 4 can be removed without damaging the resin molded part 17. |
