| 摘要 |
PURPOSE:To implement a structure having many pins, by forming a round wiring around a through hole in the surface of a package substrate, making the diameter of the wire equal to or smaller than the maximum diameter of a pin head, thereby increasing the area, in which the wiring is formed throughout the pins on the package substrate. CONSTITUTION:Many matrix shaped through holes 6 are formed in a substrate 2 comprising a reinforced epoxy glass resin. Then a wiring pattern 7 is provided on the surface of the substrate 2 by metallization. At this time, a round pattern 7a is formed around the through hole 6. The diameter of the round pattern 7a is made equal to the maximum diameter of a pin head 5a of a lead pin 5 to be attached. Then, the nail shaped lead pin 5 is driven into the through hole 6 from the upper surface of the substrate 2 to the back surface of the substrate 2 and inserted. Thereafter the lead pin 5 is fixed by solder 8. |
