| 摘要 |
PURPOSE:To prevent a microbore from being disclosed, by polishing a surface of ceramic material by abrasive fluid of Al2O3, SiO2, diamond of higher hardness in a grain size below the specific value using Sn, Pb, etc. as a polisher under a specific lapping load. CONSTITUTION:An abrasive grain of fine dust dispersed in abrasive fluid, selecting a king of the grain and its dispersed quantity from Al2O3, SiO2, diamond in accordance with the melting point and hardness of a ceramic material because the grain of hardness higher than that of a material to be polished effectively acts, is formed to a grain size of 0.5mum or less polishing the material to be polished to fine surface roughness and decreasing the thickness of its layer which changes quality by polishing. While the surface roughness is improved by preventing the grain from its secondary agglomeration and powder from melting to adhere to the material to be polished, if glycol, sulfonated oil, etc. of 5% or less are added in order to enhance a dispersion effect to pure water. Next, a polisher, selecting its material from Sn, Pb, solder in accordance with the material to be polished and the abrasive grain of fine dust, is used at a lapping pressure of 0.5-2kg for ensuring rigidity of a polishing device and holding its accuracy of rotation. In such way, a plastic fluidized layer is formed, crushing a microbore and enabling the material to be holelessly polished. |
