发明名称 CUTTING OF PLATE MATERIAL
摘要 <p>PURPOSE:To make it possible to shorten the working process and time by fixing plural stacked panels and cutting them leaving their cut lines uncut in parts and then by covering them with a non-porous sheet and cutting the uncut portions after vacuum-adsorption from the back surface. CONSTITUTION:For cutting circuit boards, a stack of panels 10 is placed on a stationary equipment 4 by use of a positioning pin 6 and the cut lines of each panel are cut for the most part using the programmed NC router or cutter. After the initial cutting, a negative pressure is generated in a space 14 by covering the whole stack of the panels 10 with a non-porous film 24, and the stack of the panels 10 is held in the prescribed position through the action of the film 24; then the NC machine tool is driven again to cut off tabs 22. In this way, the sheet of the film 24 is in place to cover the stack of the panels 10 and has almost to pores except for small areas where tabs are cut off, and therefore all cut-off pieces are held in the prescribed positions until the completion of cutting. Thus the positioning pin for each stack of panels is not needed, reducing the working process and time.</p>
申请公布号 JPS60155336(A) 申请公布日期 1985.08.15
申请号 JP19840267522 申请日期 1984.12.20
申请人 SONII TEKUTORONIKUSU KK 发明人 TOOMASU SHII IISUTON
分类号 B23Q3/08;B26D7/01;B26D7/02;B26D7/20;H05K3/00 主分类号 B23Q3/08
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