发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce the size of a pellet by disposing the outside end of a bonding pad of arbitrary row at the outer side from the inside end of the bonding pad of the outside row adjacent to the arbitrary row, thereby reducing the width of a bonding pad forming strip. CONSTITUTION:Zigzag pads formed in two rows along the end 8 of a pellet 3 are formed in hexagonal shape in which the corners of the sides which approach each other, thereby forming the outside end 5 of the inside pad 4a at the outer side from the inside end 5a of the bonding pad 4a. When the width of the end is reduced as above, zigzag pads arranged in the state that the distance between the pads of inside rows is narrower than the width of the pad can be intruded to the interior of the rows adjacent at the ends of the pads, and the width of the pad molding can be reduced in the state that the function as the bonding pad is maintained. Accordingly, even if the pellet of high integration is placed, the size can be reduced without disordering the normal function.
申请公布号 JPS60154652(A) 申请公布日期 1985.08.14
申请号 JP19840010178 申请日期 1984.01.25
申请人 HITACHI MAIKURO COMPUTER ENGINEERING KK;HITACHI SEISAKUSHO KK 发明人 OKINAGA TAKAYUKI;TATE HIROSHI;OOTSUKA KANJI;SHIRAI MASAYUKI;OKUYA KEN
分类号 H01L21/60;H01L23/485 主分类号 H01L21/60
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