| 摘要 |
Multitrack wiring substrate comprising: a section 11 with laminated layer in unworked sheet containing a plurality of connection studs 12 on one side of the section, a plurality of through holes 203 linked with the studs in a one-to-one relation, and energy distribution layers 104; a plurality of wiring layer sections 13 rolled onto the section with laminated layer in unworked sheet, each having a conductive layer 101 and an insulating layer 301 in polyimide resin formed on the conductive layer; material 201 for filling in the interconnection holes, formed inside the insulating layer so as selectively to connect the conductive layer 102 of the upper wiring layer section to the conductive layer 101 of the lower wiring layer section and made with a mixture of gold and polyimide; and an uppermost conductive layer 103 which is formed on the uppermost wiring layer section. Application to circuits with large scale integration. <IMAGE> |
