| 摘要 |
PURPOSE:To eliminate defect of short-circuit due to coating unevenness of resist generated at a bonding part of both electrodes even if a cross electrode part is formed after a pad electrode part is formed by separating the pad electrode and the cross electrode by >=50mum. CONSTITUTION:After the pad electrode 1 for wire connection is formed on a substrate 5, the cross electrode 6 is formed while being separated from the pad electrode 1 by >=50mum so as to form an input conversion section 2, an output conversion section 3 and a shield electrode 4. In the process applying the resist 7 after Al vapor deposition of the cross electrode 6, although the film thickness of the resist is made thicker at the bonding part between the pad electrode 1 and the cross electrode 6 due to step difference, since uneven coating of the resist is produced at a thickness of 20-30mum, the shortcircuit defect is not caused even if the uneven coating of the resist is caused by parting both the electrodes by >=50mum. |
