| 摘要 |
PURPOSE:To enable carrying out a characteristics test during an assembly stage by forming a rectifying unit holding a semiconductor substrate with a temperature compensation plate between internal electrodes and applying pressure between the internal electrodes by a pressure ring. CONSTITUTION:A rectifying unit 206 is assembled by putting pressure rings 215, 216 in the projections 213a, 214a of internal electrodes 213, 214 and holding in compression a silicone substrate 210 of P-N junction having aluminum electrode films 207, 208 on both the main surfaces with temperature compensation plates 211, 212 between the internal electrodes 213, 214 using a teflon bolt 217 and a teflon nut 218. Since the rectifying unit 206 is nearly a completed product, a characteristics test for the silicone substrate 210 can be carried out in this stage. A satisfactory product is sealed in an airtight container consisting of a ceramic cylinder 201, flanges 202, 203 and external electrodes 204, 205. |
