| 摘要 |
PURPOSE:To obtain the advantages of both a plating method and a screen printing method such as the low cost of the plating method and the stability of processes through the screen printing method by forming a back electrode through Ni plating and shaping a surface electrode through screen printing. CONSTITUTION:A solar cell proper after forming an antireflection film 1 is plated previously with Pd, and plated with Ni. Since the film 1 on the surface is not plated at that ime, an Ni plating layer adheres only on the back, and a back electrode 8 is formed. There is a P layer 7 under the Ni plating layer on the back, and there is no necessity for troubling the breakdown of a P-N junction on sintering. Surface electrodes 9 are shaped through screen printing by silver paste, and dried. The back is baked simultaneously, and silver paste is diffused into the film 1 and an ohmic contact with an N<+> layer 6 is taken while Ni plating as the electrode 8 is sintered. |
