| 摘要 |
<p>PURPOSE:To reduce scrap in a dicing process of forming cut grooves on a wafer with rotary blades even when dicing lines must be cut in a region having a great width, by changing the width of the cut grooves in the direction of a cutting depth. CONSTITUTION:A wafer 16 is secured on a work table 15. The cutting depth is set as shallow as possible but deep enough to remove patterns 9. The wafer is diced along dicing areas 8 with a rotary blade 11 having a width equal to or slightly smaller than that of the patterns 9. Another rotary blade 17 having a width smaller than that of the rotary blade 11 is secured on a work table 21 of the dicing apparatus. The cutting depth is set at a predetermined value, and the rotary blade 17 is rotated to dice the wafer 16. In such a manner, patterns provided within the dicing area, such as aligning patterns, can be removed without increasing the amount of cutting chips.</p> |
