| 摘要 |
<p>The bonder is provided with a single bonding head 10 which has two bonding wedges and grooves for location of wires W1, W2 under the wedges and two guides through a tongue 10A at the rear of the bonding head. It is used to perform the simultaneous bonding of two connecting wires on the contact area 2 of a semiconductor device 3 and on a conductor 5 associated with the contact area. The bonding time required for two wires of a given diameter is the same as that required to bond a single wire of the same diameter, thus twin connecting wires may be provided in half the bonding cycle time and the wire spacing is accurately determined without operator intervention. The bonder is of particular use in the manufacture of triac devices where the wires can be accurately spaced one over a first sector, the other over a second sector of the triac structure, on a contact area common to both sectors of the triac. <IMAGE></p> |
