Hot-melt adhesive compositions

摘要

The invention relates to a hot-melt adhesive composition which contains (A) from 20 to 75 parts of an ethylene-vinyl acetate copolymer, (B) from 10 to 60 parts of a partially hydrolysed ethylene-vinyl acetate copolymer or an acid-modified product thereof, and (C) from 5 to 50 parts of a polyamide resin in such a mixing ratio that the total amount of (A), (B) and (C) is 100 parts by weight. The hot-melt adhesive composition has excellent adhesive strength to various metals or plastics and in addition provides the bonded substrates with superior water resistance.