Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer

摘要

A laser beam is used to scribe an alignment mark on the back side of a lightly doped substrate of a silicon wafer containing an heavily doped internal layer. The wavelength of the laser beam is chosen such that it passes through the lightly doped substrate without absorption but is absorbed in the heavily doped internal layer to produce therein a defect which has the same position as the scribed alignment mark. Subsequent heating of the wafer causes the defect to migrate upwardly through a lightly doped epitaxial layer to the front side of the wafer and produce therein a visible mirror image of the scriber alignment mark.